VDA VLSI Design Automation Lab

Department of electronics engineering,
National Chiao Tung University, Taiwan
Home > Member > Master > Ming Fang, Lai

Basic Information

Pic Degree Gender Entry Year Name English Name
Mingfang Master M 2004 賴明芳 Ming Fang, Lai
Email Occupation
mflai@winbond.com 新唐科技
A Block and I/O Buffer Placement Methodology for Chip-Package Codesign


Category Year Conference Name Title Author
ACM-IEEE-Conference 2008 ISQED An Implementation of Performance-Driven Block and I/O Placement for Chip-Package Codesign M.-F. Lai and H.-M. Chen
ACM-IEEE-Conference 2007 ASP-DAC Fast Flip-Chip Pin-Out Designation by Pin-Block Design and Floorplanning for Package-Board Codesign R.-J. Lee, M.-F. Lai, and H.-M. Chen